one. Mounting pace

Mounting pace refers to the installation time of every component in just a specific variety, and the rack is preset. Chip equipment are at the moment mounted on high-speed pcs. Speed: 0.06-0.03s: Multi-function equipment are frequently medium-speed devices. The position pace of QFP is 1-2s, as well as the placement pace of chip components is 0.3-0.6s. The present multifunction equipment could also achieve within just 0.2s. If for high-volume SMT placement, the upper the location pace, the upper the delivery level.JUKI KE-3000 Chip Shooter is a high-speed flexible placement machine that meets your expectation. Enjoy accurate and high speed production today. Get a quote.

In accordance towards the IPC9850 common (the acceptance conventional for placement equipment), the position pace is expressed in CPH, that is certainly, the volume of areas put within a 200mm×200mm placement spot for each hour. Significant components (these as chip components and QFPS) are mounted at unique speeds. By way of example, the mounting speed of chip components is larger than or equivalent to 12000 cph, whilst the mounting velocity of QFP is larger than or equal to 1800 cph.

2. Absorption fee of elements

Ingredient suction level refers back to the means to accurately pick and put. Expressed in percent, the larger the better. Such as, the part suction fee is ninety nine.9%, that is certainly, fewer than one ingredient is permitted to be put and positioned for 1000 parts. A lot less throwing fee could be the vital to tests products high-quality for SMT chip processing.

3. Mounting angle

The mounting angle is generally 0° to 360°, and also the resolution is 0.1° to 0.001°.

Fourth, the mounting area

The location spot will depend on the transfer trajectory on the placement equipment as well as motion array of the location head. Normally, the minimum PCB dimensions is fifty mmx50 mm, as well as greatest PCB size need to be higher than 250 mmx30 mm. The most mounting spot of ??machines of various producers differs. The utmost PCB size from the exact same variety of equipment is frequently divided into a few specs: huge, medium and compact.

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The Automated X-ray transmitting tube emits X-rays go through the exam sample. A detector is on a further side on the AXI machine, that to transfer the X-ray to noticeable light-weight and provide the optical impression by the digicam. The sample product absorbs the x-rays to various levels owing to its possess density and atomic weight. Consequently, the imaging about the receiver will be noticeably different, the higher density, the much better absorption of X-ray, therefore the shadow graphic is clearer. The closer to the X-ray tube conduct the bigger picture, as well as farther on the X-ray tube execute the more compact picture.

What flaws can X-ray detect ?

The x-ray machine's high repeatability accuracy serves to boost production. The unique angle for sample inspection also makes it suitable for mass testing.

The X-ray can detect the internal predicament of components’ soldering. It utilize the penetration potential of X-ray to detect the inadequate solder, improperly soldered, solder small together with other problems of solder joints.

When there are problems these as porosity, slag inclusion and incomplete soldering, a vibrant place or simply a brilliant line are going to be fashioned during the defect space. Visually, we are able to judge whether or not an area is defect in accordance as to if it really is brighter in comparison to the bordering track record space within the flaw detection picture. In the standpoint of impression processing, we could judge whether or not a place is really a defect according for the pixel grey worth within the flaw detection picture.

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